Facilities

SDL’ s manufacturing facility of 12,000 sq. ft. at Hayes has its production area static controlled with a static dissipative floor, wrist straps and dissipative workwear protection are worn at all times. All facilities are controlled in line with ISO9001:2000 procedures.

• Twin placement heads with 2 vacuum tips each
• Intelligent component feeders
• Flexible component carrier tray for flat packs / ball grid arrays etc.
• Automatic vision system for PCB & component alignment
• Accuracy of placement better than 0.04mm
• PCB size up to 500mm x 400mm
• Component placement up to 4000/hr
• Offline programming & Cad data input

• BGA rework facility

• Vapour Phase Technology
• Temperature Profiling
• Infra Red preheating
• Rapid cooling system
• 100% Inert Gas Atmosphere - No Oxidisation
• No Risk of insoldered joints (including BGA's)
• No Risk of overheating - Max Temperature 230°C
• Wide range of applications - Flexible circuits to thick densely populated multilayer PCB's, consistency without overheating
• Uniform temperature distribution across entire PCB
• No de-lamination of PCB material
• Inexspensive, safe solution without component stress
• Max Board size 540mm x 340mm

• Temperature range -70°C to +180°C, size 800mm x 855mm x 825mm.
• Vibration 0-100Hz various waveforms & cycling profiles to 12G.
• EMC Pre-Compliance radiated & conducted emissions 9KHz to 1.8GHz.

• Computer controlled
• Laser etched stainless steel stencils
• Automatic optical alignment to PCB
• Print accuracy of ± 0.02mm
• Allows fine pitch (0.4mm) printing without problems like solder bridging
• Screening size up to 500mm x 500mm